Time: 1:35 – 2:25
Location: Room G/H
Speaker:
Tim Lee
Boeing Technical Fellow
2025 IEEE-USA President
Abstract:
My talk will focus on microelectronics megatrends, major challenges and innovations needed to find solutions. I will describe roadmaps of both advanced node CMOS and heterogeneous integration as complementary technologies that are needed to support the AI revolution. Finally I will describe key research programs that support Texas as being a future semiconductors center in both North and Central Texas.
Speaker Bio:
Tim is a Boeing Technical Fellow and the 2025 IEEE-USA President. His area of research is in advanced semiconductors and 2.5D/3D packaging for next generation microelectronics with emphasis for aerospace & defense applications. His IEEE-USA focus is to engage IEEE members in dialogue with Congress to share our priorities for R&D funding / support for technology domains that benefit economic vitality and natural security.