{"id":1739,"date":"2025-11-06T10:47:54","date_gmt":"2025-11-06T16:47:54","guid":{"rendered":"https:\/\/www.metrocon.org\/2025\/?page_id=1739"},"modified":"2025-11-09T14:08:59","modified_gmt":"2025-11-09T20:08:59","slug":"megatrends-in-microelectronics-powering-the-ai-revolution-and-americas-future","status":"publish","type":"page","link":"https:\/\/www.metrocon.org\/2025\/megatrends-in-microelectronics-powering-the-ai-revolution-and-americas-future\/","title":{"rendered":"Megatrends in Microelectronics: Powering the AI Revolution and America\u2019s Future"},"content":{"rendered":"\n<p><strong>Time:<\/strong> 1:35 \u2013 2:25<br><strong>Location:<\/strong> Room G\/H<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Speaker:<\/h2>\n\n\n\n<p>Tim Lee<br>Boeing Technical Fellow<br>2025 IEEE-USA President<br><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Abstract:<\/h2>\n\n\n\n<p>My talk will focus on microelectronics megatrends, major challenges and innovations needed to find solutions. I will describe roadmaps of both advanced node CMOS and heterogeneous integration as complementary technologies that are needed to support the AI revolution. Finally I will describe key research programs that support Texas as being a future semiconductors center in both North and Central Texas.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Speaker Bio:<\/h2>\n\n\n\n<p>Tim is a Boeing Technical Fellow and the 2025 IEEE-USA President. His area of research is in advanced semiconductors and 2.5D\/3D packaging for next generation microelectronics with emphasis for aerospace &amp; defense applications. His IEEE-USA focus is to engage IEEE members in dialogue with Congress to share our priorities for R&amp;D funding \/ support for technology domains that benefit economic vitality and natural security.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Materials:<\/h2>\n\n\n\n<p><a href=\"https:\/\/www.metrocon.org\/2025\/wp-admin\/post.php?post=1560&amp;action=edit\"><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Time: 1:35 \u2013 2:25Location: Room G\/H Speaker: Tim LeeBoeing Technical Fellow2025 IEEE-USA President Abstract: My talk will focus on microelectronics megatrends, major challenges and innovations needed to find solutions. I will describe roadmaps of both advanced node CMOS and heterogeneous integration as complementary technologies that are needed to support the AI revolution. Finally I will [&hellip;]<\/p>\n","protected":false},"author":6,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1739","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/pages\/1739","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/comments?post=1739"}],"version-history":[{"count":2,"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/pages\/1739\/revisions"}],"predecessor-version":[{"id":1795,"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/pages\/1739\/revisions\/1795"}],"wp:attachment":[{"href":"https:\/\/www.metrocon.org\/2025\/wp-json\/wp\/v2\/media?parent=1739"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}